A Semiconductor OEM designed a polymer component that would support a 300mm wafer during processing.  The polymer had to have a high flexural modulus, good chemical resistance, with high purity levels and an unfilled matrix.

Design Requirements

• 1,100,000 psi Flex modulus

• Chemical Resistant

• Dimensionally stable

• Density of 1.35 g/cm3 or less

• Unfilled polymer

• The component has thin cross sections machined in the center of the part so property loss in the internal regions was prohibited.

Piper Delivered

Near Net a larger molded shape of PrimoSpire® SRP (Kyron™ 1311) that was .50” thick and exhibited 0% porosity or loss of properties in the internal region. 

Back to Applications